Horizontal Electroless Copper | Products | MacDermid Enthone
Home // Products & Applications // Printed Circuit Board // Primary Metallization // Horizontal Electroless Copper M-Copper EF MacDermid Enthone M-Copper EF is the only electroless copper system on the market that is sold by an international plating supplier which can outperform local suppliers at a competitive price.
Circuposit 6500 Horizontal Electroless Copper Process for ...
Horizontal process for ease of handling, uniform chemistry application, reduced operator exposure to chemicals & vapors; Highly stable Alkaline Ionic Catalyst, with little or no sludge formation; Tartrate-based electroless copper formulated to provide excellent throwing power, bath stability, and ease of treatment.
Circuposit™ 4000 Horizontal Electroless Copper - DuPont
Circuposit™ 4500 Electroless Copper is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.
Vertical Electroless Copper | Metallization | MacDermid ...
Home // Products & Applications // Printed Circuit Board // Primary Metallization // Vertical Electroless Copper Maintaining The Patented Pretreatment System Electroless copper has been the manufacturing standard for over 30 years, and we have been there since the beginning.
Horizontal Electroless Copper System - Line Plating Machine
A new market-sized Horizontal Electroless Copper Processing System designated the Model 990D is just 41′ long and 71″ wide, the system is designed to fit the needs of current North American plating operations. The Model 990D Electroless Copper System …
Printoganth® U Plus | Atotech
Printoganth ® U Plus is Atotech’s most reliable electroless copper process for horizontal application. Leading HDI manufacturers in Taiwan and China that are active in the field of consumer electronics are relying on Printoganth ® U Plus since years because of its mass production proven, unparalleled reliability performance and excellent copper characteristics.
Developments in Electroless Copper Processes to Improve ...
approximately 25% of the total layer needing to be removed, the electroless Copper thickness is an important factor when looking to increase line and space capability. Uniformity of the Deposited Copper Layer Has to Improve As pointed out above, the thickness of the total Copper has a direct impact on the line and space capability of the process.
Chapter Electroless Copper In Printed Wiring Board Fabrication
Electroless Copper in Printed Wiring Board Fabrication 337 The classical steps of pretreatment will now be taken in sequence. Cleaning The first step in any pretreatment line is to clean the entire composite-the laminated copper and the pierced dielectric material. The cleaner is typically
Desmear and metallization | Atotech
Horizontal electroless copper Very good coverage and throwing power despite challenging geometry of the BMV Printoganth ® T1 meets the needs of advanced HDI …
Electroless Copper Plating A Review: Part I
Electroless copper plates much more slowly, and is a much more expensive process, than electrolytic copper plating. Electroless copper plating, however, offers advantages over electrolytic plating that make it the method of choice in certain cases. Electroless copper plates uniformly over all surfaces, regardless of size and shape ...
Printoganth® P2 | Atotech
Universal Horizontal Electroless Copper Process for Advanced Dielectrics including 5G and Flex PCBs. Dielectric adhesion and coverage Printoganth® P2 has excellent adhesion with no blistering characteristics on even the smoothest substrates.
Equipment (Electronics) | Atotech
The leading horizontal electroless copper plating line, the Uniplate ® LB, is the world standard for classical horizontal through-hole metallization. Systems solutions are available for a huge variety of board thicknesses and sizes. More than 300 Uniplate LB lines have been installed for …
Properties of electroless Cu films optimized for ...
A production-level electroless copper bath designed for horizontal plating was characterized. In-situ stress evolution of the Cu(Ni) films was studied with XRD and via substrate curvature. Stress of the Cu films depends on substrate choice (metal or ABS polymer). Stress and its relaxation are inversely proportional to film thickness.
Circuit Board Formation | Primary Metallization
Horizontal Electroless Copper MacDermid Enthone M-Copper EF is the only electroless copper system on the market that is sold by an international plating supplier which can outperform local suppliers at a competitive price.
Meeting the horizontal electroless copper plating challenge
Meeting the horizontal electroless copper plating challenge. Feng Liu. Dow Electronic Solutions R&D scientist, Interconnect Technologies Liu’s research interests are ionic and nanoparticle catalyst, electroless and electrolytic copper metallization, and electrolytic nickel metallization.
Circuit Board Formation | Direct Plating | MacDermid Enthone
Trusted by over 250 of the world’s leading manufacturers, Blackhole is an automated, horizontal process whose unique technology enables users to reduce cycle time, decrease overall water consumption, completely eliminate the use of formaldehyde, and produce less waste than electroless copper plating.